Surface Mount Technology Process Optimization

Published in: Innovation and Development for the Americas: Engineering, Education, Research and Development: Proceedings of the 8th Latin American and Caribbean Conference for Engineering and Technology
Date of Conference: June 1-4, 2010
Location of Conference: Arequipa, Peru
Authors: Alex Marron
Abdelkader Mazouz
Refereed Paper: #133

Abstract

One of the objectives in conducting this work is to develop a process optimization for manufacturing. Screen printing is the first and one of the most critical process steps in a printed circuit board assembling manufacturing. Solder paste volume on each pad has a direct effect on the product quality and reliability. This experiment concentrates on solder paste volumes obtained on fine pitch pad geometry’s. Pads with this geometry have a 0.020” pitch between lead centers. The key is to have just the right volume deposited in the pad. Too little will cause a faulty joint or an unreliable joint with an electrical continuity failure potential. On the other hand, too much will create solder short problems or worse yet, solder balls. Solder balls can become detached after the product has been tested, causing potential field failures. A 2 4 factorial design has been considered in order to optimize the process.