Latin American and Caribbean Consortium of Engineering Institutions

Conference Track:  Information Technology

Keywords:         Mold/Die, Cost, RFQ

Contact Title:     Mr.

Contact First Name: Hongdian

Contact Last Name:  Wang

University:       Florida International University

Web:              www.fiu.edu

Position:         MS Student

Country:          USA

Email:            hwang001@fiu.edu

Fax:              (305)348-3721

Paper Title: 

METHODOLOGIES FOR RAPID RESPONSE TO REQUEST FOR QUOTATION IN MOLD/DIE INDUSTRY

Abstract: 

Mold/Die industry is a typical Make-To-Order (MTO) Manufacturing.  The ability to respond quickly and effectively to request for quotation (RFQ) from customers can be significant source of competitive advantage to mold/die manufacturing companies.  This paper presents a  new cost model for Mold/Die lifecycle cost, sets up a new architecture, and discusses the related enabling technologies.  The RFQ processing system built upon the new cost model and architecture can provide a quick and accurate response to customer's RFQ.  The work presented in this paper complements the ongoing efforts to electronic commerce. 

Mailing Address: 

Dept. of Industrial & Systems Engineering

Florida International University 

10555 W Flagler St., EC 3120

Miami, FL 33174 USA

Phone:  (305)348-3192

Authors:

Hongdian Wang/hwang001@fiu.edu / Florida International University

Dr. Shih-Ming Lee/ leesm@fiu.edu / Florida International University